We do not subcontract the hard part. DASQI owns engineering and production across 6,700+ m² in Shenzhen and Taipei, with 300+ skilled operators and automated SMT lines — so quality, cost and lead time stay in our hands.
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Our SMT plant runs 12 surface-mount lines — a balanced mix of high-speed and flexible lines — feeding a cell-based, line-balanced assembly flow. High-speed lines place the high-volume passive and IC components, while flexible lines handle RF shields, connectors, BTB connectors, batteries and odd-form parts that need precise placement. Together the lines support our rated capacity of 800,000 units per month, with an SMT manufacturing partner providing additional scale-up headroom for demand above that.
Line configuration: high-speed lines (e.g. Fuji NXT-class platforms) plus flexible/low-speed lines (e.g. Yamaha YSM-class platforms) — exact models to be confirmed by the production team.
Placement throughput: 12 lines sized for high daily placement counts; rated SMT placement capacity [to be provided — e.g. XX billion components placed per month] and total placement points balanced against first-pass yield on dense, double-sided RF boards.
Solder process: nitrogen reflow profiles tuned per product; lead-free, with zone-by-zone thermal profiling and SPI (solder-paste inspection) at the stencil printer.
Optical inspection: 3D AOI after placement and 2D/X-ray inspection for BGA and bottom-termination components, so hidden joints are verified, not assumed.
Traceability: MES-tracked boards with lot-level genealogy, so any defect can be traced to a panel, placement head and feeder within minutes.
ESD & cleanliness: controlled ESD floors, ionised workstations and humidity-controlled storage for GNSS modules and batteries.
DASQI's assembly plant operates 6+2 production lines — six high-volume lines plus two flexible lines for complex, low-volume and hybrid-laser builds — with a rated assembly capacity of up to 800K pcs per month. Every finished unit goes through 100% full functional inspection, and the two features that matter most to a golf customer — GPS positioning and the golf course map — are released only after passing three independent test gates.
100% full-function check (FCT) on every unit: power, display, keys, speaker, vibration motor, Bluetooth pairing and app sync.
Three-gate GPS & map validation — functional, performance and on-course — described below.
In-house labs cover RF conducted/power, EMC, drop, ingress (IPX) and battery safety, so validation never waits on a third-party slot.
AQL sampling plus lot-level serialised test logs; outgoing units are packed only after the lot sign-off.
Functional Testing
Each unit is powered on and verified end-to-end: GNSS chip initialisation, first-fix acquisition, Bluetooth/APP connection, map database loading and basic distance readout. A unit that cannot talk to the app or load the course database is stopped here, not shipped.
Performance Testing
Under lab conditions we measure acquisition time in open sky and under simulated tree cover, multi-constellation (L1+L5) accuracy against a reference, RF output power, sensitivity, battery runtime and environmental behaviour (temperature/humidity). This is where spec compliance is proven before volume.
On-Course Testing
Samples are taken to real golf courses to confirm the experience that customers actually buy: front/centre/back distances, hazard and layup markers, automatic course recognition, slope-adjusted distances and green-contour rendering — checked against the 43,000-course database on multiple holes and multiple courses.
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Antenna chambers, vector network analysers, oscilloscopes, spectrum analysers and 3D printing sit a few steps from the firmware benches — engineering and validation under one roof, so a design change is measured the same day, not next week.
RF & antenna: anechoic chamber and VNA for antenna return loss, efficiency and OTA performance; spectrum analyser for spurious emission and receiver sensitivity.
GNSS tuning: reference receivers and a multi-constellation test bed for first-fix, re-acquisition and accuracy under tree-cover and jamming scenarios.
Environmental: thermal/humidity chambers, drop and vibration rigs, and ingress (IPX) test tanks for design verification before certification.
Rapid prototyping: in-house 3D printing and CNC for enclosures and fixtures, so tooling and test jigs are ready ahead of the build.
Co-location: firmware and golf-algorithm engineers sit beside the bench, so a software change is verified on hardware the same day.
Order-picked, label-ready and drop-ship capable. We support retail-ready, Amazon FBA-compliant, eco and private-label packing, and integrate with your 3PL for direct-to-market flows. Shipments move EXW, FOB or DDP.
Inbound control: supplier lots are IQC-inspected and quarantined until released; FIFO/FEFO rotation protects battery and adhesive shelf life.
Storage: ESD-safe racking for PCBAs, climate-controlled area for batteries, and bonded/serialised bins for finished goods.
Pick & pack: order-picked and label-ready by SKU, market and language; barcode/scanned verification at pack-out to prevent mis-ships.
Channel packing: retail carton, Amazon FBA labelling, eco and private-label options; kitting and gift-box builds supported.
Logistics: integration with your 3PL for drop-ship and direct-to-market flows; EXW, FOB or DDP terms; documentation for CE/FCC/KC/TELEC market entry.
Spares & RMA: allocated spare stock and a returns workflow feeding continuous-improvement and field-data review.
ISO 9001
Documented, audited processes across engineering and production, reviewed annually.
Controlled emissions, waste handling and material compliance.
Audited working conditions, working hours and health & safety for European retail channels.
4-pillar audit covering labour, health & safety, environment and business ethics.
Lot-controlled BOM, serialised test logs and full component pedigree with MES system, retrievable in minutes.
CE, FCC, RoHS, CA Prop 65, UKCA, TELEC and KC, testing and market-ready documentation packages.
Stage-gated verification with written sign-off at every step, from EVT to MP.
Spares, firmware upkeep, OTA updates, RMA handling and recall-ready processes after launch.
Social Compliance & Factory Audit
We hold BSCI and SMETA 4-pillar social-compliance audits and ISO 14001 environmental certification, and we host customer and third-party audits on site. Recent reports, corrective-action records and line-capacity data are shared on request. If your retail channel requires a specific standard, tell us at RFQ stage and we will confirm it before you commit.
Golf GPS rangefinder design, R&D and ODM/OEM manufacturing.
Shenzhen DASQI Technology Co., Ltd.
Taiwan DASQI Inc.
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© 2026 Shenzhen DASQI Technology Co., Ltd. All rights reserved. — Golf GPS Rangefinder Design · R&D · ODM / OEM Manufacturing
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